Wafer Reclaim/Reclean


We have the capabilities to process 100mm, 125mm, and 200mm wafers.

List of Services

  • Full Reclaim
  • EPI Reclaim
  • Strip & Clean
  • Double Side Lap
  • Specialty Processing
  • Virgin Test Wafers
  • Applications Engineering
  • Inventory Mangement Services


Remove EPI, oxides, photoresist or any other films you may need removed.


Double sides lapping is available.


Each wafer can be lasermarked with the same value, lasermarked in sequential series or any other patterns.

Etching and Films

Our polish step removes all scratches and pits from wafer surfaces. This allows multiple reclaims on each wafer, with increased cost savings.